Hbm design engineer - member of technical staff
Company: Micron
Location: Atlanta
Posted on: April 19, 2024
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Job Description:
Our vision is to transform how the world uses information to
enrich life for all.Micron Technology is a world leader in
innovating memory and storage solutions that accelerate the
transformation of information into intelligence, inspiring the
world to learn, communicate and advance faster than ever.Our
Opportunity Summary: For more than 43 years, Micron Technology,
Inc.has redefined innovation with the world's most advanced memory
and semiconductor technologies.We're an international team of
visionaries and scientists, developing groundbreaking technologies
that are transforming how the world uses information to enrich
life.We are looking for a strong candidate to become a Member of
Technical Staff which focuses on HBM Design.Are you passionate
about systems and architecture for the next generation of
high-performance memory that has wide-ranging applications and
inspires change in memory systems? In the HBM Design Engineering
team at Micron, we deliver novel solutions to increase bandwidth,
and capacity and reduce latency across memory and storage
solutions.The seniority level offered will be based on the
combination of experience and education.You will be part of a
highly multi-functional team of technical domain experts
collaborating closely with a worldwide team of Design Engineering,
Product Engineering, Process Development, Package Engineering, and
our Business Units to implement a common goal of ensuring our
future HBM roadmap is successful.You will apply your deep
understanding of memory array architectures, high-speed interface
design, logic & custom circuit design, memory subsystem operation,
high-performance computing architectures, and 2.5 D & 3 D package
integration to understand and analyze bottlenecks and propose
innovative architectures to target best-in-class performance,
power, cost, reliability and quality for Micron's HBM product
portfolio.The seniority level offered will be based on the
combination of experience and education.In HBM DEG (High Bandwidth
Memory - DRAM Engineering Group), we innovate and integrate
end-to-end groundbreaking front-end and backend processes with
groundbreaking design, debugging various tests, and qualification
techniques to develop the lowest power per bit solutions to improve
customer experience in the field of ML (Machine Learning) and AI
(Artificial Intelligence).The success of a sophisticated product
such as HBM relies vastly on vertical integration and the various
engineering working in unison.To provide greater detail, our HBM
technology pertains to stacking numbers of DRAM chips along with a
logic chip within one package through an assembly technology called
TSV (Through Silicon Via).This greatly increases the memory density
in a package, while allowing very high-speed signal
transmission.Furthermore, "high bandwidth"; is an outstanding
memory design area where custom gate-level design and RTL style
logic design are blended into the same product, and most of the DDR
or LPDDR design is based on the gate-level design only.Lastly,
verification and testing (validation) of HBM is the most
challenging due to the total size of the design and complexity of
the functions, and in addition to craft, many innovations are
needed for verification and validation of the HBM product, thereby
making it uniquely exciting.Our team vision is a continuing desire
to develop your skills working in an inclusive diverse environment
of multicultural Teams across worldwide geographies! Enabling the
creative career path you deserve with a collaborative environment
and groundbreaking technology and growing upon your imagination and
creativity.(Disclaimer): While you may not exhibit all of the
characteristics/skills listed below today, we are highly interested
in a teammate who is motivated to grow in technical breadth and
depth.Suppose you are open to learning while being a valued member
of a team of premier engineers.In that case, we are determined to
help build upon your existing foundation, while rapidly growing
your individual and collaborative skills in this exciting and
outstanding opportunity.What's Encouraged Daily: Collaborate with
the architecture team and external customers on new product
specifications Pathfinding to explore new system-level solutions
for future HBM products and make recommendations after performing
highly technical feasibility analyses Drive interface logic chip
and memory architecture solutions Develop circuit designs for the
memory array, input buffer, output buffer, control logic, address
decode, datapath, internal test logic, power generators, PLL Chip
in expert knowledge to advance innovative technical solutions
Provide advice and counsel to senior management on significant
technical issues Coordinate and lead the layout process, including
placement and routing optimization Contribute to cross-group
communication to work towards standardization and group success
Proactively solicit feedback from Standards, CAD, modeling, and
verification groups to ensure the design quality Drive innovation
into the future Memory generations within a dynamic work
environment How To Qualify: MSEE or Greater 12+ years of relevant
job/skill-related experience Experience delivering highly technical
solutions In-depth technical expertise in one or more areas - DRAM
memory array design, high-speed clocking and interface development,
analog circuit design, digital/logic and custom circuit design,
power delivery optimization, CMOS & semiconductor device physics,
2.5 D and 3 D packaging technologies What Sets You Apart: Good
verbal and written communication skills with the ability to
efficiently synthesize and convey sophisticated technical concepts
to other partners and leadership Consistent track record of
innovation and problem-solving in high-performance memory
development A self-motivated, hard-working team player who enjoys
working with diverse abilities and backgrounds Having an innovative
approach that is open to improving upon any of our processes or
products.Potential Team Member Locations: Allen, TX Atlanta, GA As
a world leader in the semiconductor industry, Micron is dedicated
to your personal wellbeing and professional growth.Micron benefits
are designed to help you stay well, provide peace of mind and help
you prepare for the future.We offer a choice of medical, dental and
vision plans in all locations enabling team members to select the
plans that best meet their family healthcare needs and budget.
Micron also provides benefit programs that help protect your income
if you are unable to work due to illness or injury, and paid family
leave.Additionally, Micron benefits include a robust paid time-off
program and paid holidays.For additional information regarding the
Benefit programs available, please see the Benefits Guide posted on
micron.com/careers/benefits.Micron is proud to be an equal
opportunity workplace and is an affirmative action employer.All
qualified applicants will receive consideration for employment
without regard to race, color, religion, sex, sexual orientation,
age, national origin, citizenship status, disability, protected
veteran status, gender identity or any other factor protected by
applicable federal, state, or local laws.To learn about your right
to work click here.To learn more about Micron, please visit
micron.com/careers For US Sites Only: To request assistance with
the application process and/or for reasonable accommodations,
please contact Micron's People Organization at
hrsupport_na@micron.com or 1-800-336-8918 (select option #3) Micron
Prohibits the use of child labor and complies with all applicable
laws, rules, regulations, and other international and industry
labor standards.Micron does not charge candidates any recruitment
fees or unlawfully collect any other payment from candidates as
consideration for their employment with Micron.
Keywords: Micron, Macon , Hbm design engineer - member of technical staff, Engineering , Atlanta, Georgia
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